Processing apparatus

ABSTRACT

A processing apparatus for transferring a relief pattern on a mold to a resist on a substrate through a compression of the mold against the resist, includes a supplier for supplying the resist between the substrate and the mold, and a recovery unit for recovering the resist.

BACKGROUND OF THE INVENTION

The present invention relates generally to processing apparatuses, andmore particularly to a processing apparatus that transfers a pattern ona mold as an original onto a substrate such as a wafer. The presentinvention is particularly suitable for a processing apparatus that usesthe nanoimprint technology.

The nanoimprint technology is one alternative to the photolithographythat uses the ultraviolet (“UV”) light, X-rays and electron beams toform fine patterns for semiconductor devices. The nanoimprint presses(or stamps) a model (or a mold), on which a fine pattern has been formedby the electron-beam exposure etc., against a substrate such as a waferto which a resinous material (resist) is applied, thereby transferringthe pattern onto the resist. See, for example, S. Y. Chou, et al.,Science, Vol. 272 pp.85-87, 5 Apr., 1996. It is already demonstratedthat the nanoimprint can transfer a fine shape of about 10 nm, andattracts attention especially as a fine periodic pattern forming meansfor magnetic recording media. Active researches and developments areglobally under way.

The nanoimprint sometimes uses the vacuum environment to preventintrusions of air bubbles between a mold and a substrate. Methods thatfacilitate the resist flow at the press time include a (heat cycle)method of heating polymer as the resist more above the glass transitiontemperature for transfer, and a (photo-curing) method of exposing andcuring the UV curable resin as the resist while pressing it with atransparent mold, and of releasing the mold.

A manufacture of semiconductor integrated circuits (“ICs”) requires anoverlay that transfers the next pattern with a precise alignment with acircuit pattern already formed on a substrate. The heat cycle methodheats the resist, causes the substrate and mold to thermally expand witha temperature rise, and has difficulties in maintaining the overlayaccuracy. Accordingly, the photo-curing method, in which temperaturecontrol is relatively easy, is more suitable in applying the nanoimprintto the manufacture of the semiconductor ICs.

For the minimum critical dimension (“CD”) of a semiconductor IC patternof 100 nm or less, the resist requires a low-viscosity material to fullyfill in the mold's fine structure. A nanoimprint apparatus typicallysuccessively transfers a pattern onto a wafer surface in astep-and-repeat manner. Here, the “step-and-repeat manner” is one modeof exposure method that moves a wafer stepwise to an exposure area forthe next shot every shot of cell projection onto the wafer. However, dueto the low viscosity of the resist, it is difficult to previously applyresist to a substrate, transport and mount the substrate as in anexposure apparatus. One proposed method drops a proper quantity everytime the mold is pressed in transferring each shot. See, for example, M.Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M.Wedlake, T. Michaelson, S. V. Sreenivasan, J. G. Ekerdt and C. G.Willson. “Step and Flash Imprint Lithography: A new approach to highresolution patterning.” Proc. SPIE 3676 (I): 379 (1999).

The mold includes plural patterns for plural chips, and generally has arectangular shape, whereas a wafer has a circular shape. Therefore, intransferring a mold pattern matrix-wise onto a wafer, the moldoutstretches the wafer's peripheral shot (referred to as a “peripheralshot” hereinafter) that is smaller than the mold size, thus resulting ina partial transfer of the mold pattern. The partial transfer of the moldpattern to the peripheral area is economical and beneficial because someof the plural chip patterns in the mold are transferred.

However, the low-viscosity resist flows out from the peripheral shot,and contaminates the processing apparatus and the wafer chuck for fixingthe wafer. Thus, uneconomically, the prior art cannot transfer the moldpattern to the peripheral shot.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to a processing apparatus that hasgood overlay accuracy, fine processing and economical efficiency, andcan prevent resist's contaminations.

A processing apparatus according to one aspect of the present inventionfor transferring a relief pattern on a mold to a resist on a substratethrough a compression of the mold against the resist, includes asupplier for supplying the resist between the substrate and the mold,and a recovery unit for recovering the resist.

A processing apparatus according to another aspect of the presentinvention for transferring a relief pattern on a mold to a resist on asubstrate through a compression of the mold against the resist, includesa support for supporting the substrate arranged on a more upstream sidethan the mold in terms of a gravitational direction.

A device manufacturing method according to still another aspect of thisinvention including the steps of transferring a pattern onto resist on asubstrate using the above processing apparatus, and etching thesubstrate. Claims for the device manufacturing method that exhibitsoperations similar to those of the above processing apparatus coverdevices as their intermediate products and finished products. Suchproducts include semiconductor chips, CCDs, LCDs, magnetic sensors,thin-film magnetic heads, etc.

Other objects and further features of the present invention will becomereadily apparent from the following description of the embodiments withreference to accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of a processing apparatus accordingto a first embodiment of this invention.

FIG. 2 is an enlarged sectional view of a resist recovery means for theprocessing apparatus shown in FIG. 1.

FIGS. 3A and 3B are schematic plan views showing a shot layout of awafer.

FIG. 4 is a schematic sectional view showing a resist recovery meansapplicable to a processing apparatus as a second embodiment of thisinvention.

FIG. 5 is a schematic sectional view showing a resist recovery meansapplicable to a processing apparatus as a third embodiment of thisinvention.

FIG. 6 is a schematic sectional view of a processing apparatus as afourth embodiment of this invention.

FIG. 7 is an enlarged sectional view of a resist recovery means for theprocessing apparatus shown in FIG. 6.

FIG. 8 is a flowchart for explaining a method for manufacturing a device(semiconductor chips such as ICs, LSIs, and the like, LCDs, CCDs, etc.)using the above processing apparatus.

FIG. 9 is a detailed flowchart for Step 4 shown in FIG. 8.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring now to the accompanying drawings, a description will be givenof a photo-curing nanoimprint apparatus 10 according to a firstembodiment of this invention. In each figure, the same reference numeraldenotes the same element, and a duplicate description thereof will beomitted. Here, FIG. 1 is a schematic sectional view of the nanoimprintapparatus 10.

The nanoimprint apparatus 10 has a photo-curing means, a mold 11, a molddriver, a wafer 21, a wafer driver, a resist supply means, a resistrecovery means, and other mechanisms.

The photo-curing means is a means that irradiates the UV light to aresist 42 via the mold 11, having a light source 15 and an illuminationoptical system 14. The light source 15 includes a mercury lamp (notshown), and the like that generate the UV light. The illuminationoptical system 14 includes lenses and apertures that shape theillumination light for exposing and hardening the resist and irradiatinga resist surface, a shutter that switches between a light irradiationstate and a light shielding state.

The mold 11 has a fine structure to be transferred, and is made of atransparent material such that it transmits the exposure light forhardening resist.

The mold driver includes a mold chuck 12 for holding the mold 11 on theapparatus 10, and an imprint mechanism 13 as a driver that presses themold 11 downward. The imprint mechanism 13 moves the mold 11longitudinally, and controls an orientation of the mold 11 and analignment between the mold 11 and the wafer 21 for close contact betweenthe mold transfer surface and the wafer 21.

The wafer 21 is an object onto which a pattern on the mold 11 istransferred, and which is made into a semiconductor IC through thesubsequent steps.

The wafer driver includes a wafer chuck 22 that holds the wafer 21, anda wafer stage 23 for adjusting the position and orientation of the waferchuck 22. The wafer stage 23 moves in XY plane directions, and enablesthe whole area of the wafer to be transferred. The wafer stage 23provides a precise alignment, and overlay of a fine pattern. The waferstage 23 serves to position the wafer 21, and adjust the orientation ofthe wafer 21's surface.

The resist supply means includes a tank 31 that stores resists 41, 42that have not yet received the UV light or have not yet been cured, anozzle 32 for dropping the resist on the wafer surface, and a valve (notshown) that drops or stops dropping the resist 42 from the nozzle 32.

The resist recovery means includes a recovery port 33 and a recoveryunit 34. The recovery port 33 is provided in the surface of the waferchuck 22 to attract and recover the resist 42 spilt from the wafersurface. The recovery unit 34 includes a vacuum pump, a filter, etc.(any of them not shown), and recovers the resist by setting thedownstream of the recovery port to the negative pressure.

Other mechanisms include a stool 24, a damper 25, a frame 26, analignment scope 27, and a reference mark table 28. The stool 24 supportsthe whole apparatus 10 as well as forming a reference plane for thewafer stage 23 to move along. The damper 25 serves to eliminatevibrations from the floor, supporting the stool 24. The frame 26supports components from the light source 15 to the mold 11 above thewafer 21. The alignment scope 27 measures a position of an alignmentmark on the wafer 21, and positions the wafer stage 23 based on theresult. The reference mark table 28 has a reference mark used for analignment between the coordinate of the alignment scope 27 and thecoordinate of the wafer stage 23.

In operation, the wafer 21 to be transferred is mounted on the waferchuck 22 by a wafer feed system (not shown). The wafer chuck 22 holdsthe wafer 21 through the vacuum attraction means. The alignment scope 27sequentially measures alignment marks on the wafer surface supported bythe wafer stage, measuring the position of the wafer 21 with highprecision. Each transfer coordinate is computed based on the measuredresults. Based on the results, a transfer is sequentially provided in astep-and-repeat manner. After all the transfers are completed, the wafer21 is fed out and the next wafer 21 is fed in.

In transfer, before the wafer is moved to the transfer position, thenozzle 32 drops an adequate amount of resist to the transfer position.The wafer stage 23 then moves and positions the wafer 21 to the transferposition. Upon completion of the positioning, the imprint mechanism 13descends the mold 11, and presses it against the wafer 21. A load sensorin the imprint mechanism 13 determines a completion of the pressing.After the mold is pressed, the illumination light is irradiated andcures the resist 42. After the resist is cured, the mold 11 is pulled upand moved to the next transfer position (or shot).

A detailed description will now be given of a transfer to a peripheralshot. FIG. 3A shows a shot layout of the wafer 21. 51 denotes areaspatterned by the mold 11, i.e., an area (shot) that is formed by a onemold pressing and exposure light irradiation. Each shot has four similarpatterns 52, and each pattern 52 corresponds to one semiconductor chip.For convenience of explanation, 52 is referred to as a chip. In otherwords, a four device patterns (chips 52) are transferred per shot. Thelayout in FIG. 3A is an example of 21 shots. The shot layout of FIG. 3Aincludes peripheral shots at the wafer's periphery to which a completepattern cannot be transferred. However, it is understood that two chipsout of four in the peripheral shot are not defective and thus can beeffectively used.

Referring now to FIG. 2, a further detailed description will be given ofthe peripheral shot. Here, FIG. 2 is a sectional view of the wafer chuck22. The mold 11 is ready to be pressed after aligned. The surface of thewafer chuck 22 is provided with openings that attract the wafer 21, andare connected to a vacuum pumping system (not shown) through a vacuumattracting pipe 29 in the wafer chuck 22. A valve (not shown) in thepipe opens and closes so as to fix and release the wafer.

The recovery port 33 as a groove in the surface of the wafer chuck 22extends along the wafer's circumference, and is connected to a recoverypipe 35. The recovery unit 34 attracts the applied resist 41 that isspilt from the wafer 21 through the recovery port 33 and the recoverypipe 35 for recovery. As a result, the recovery port 33 recovers theresist 41 that flows out of the wafer 21 in transferring to a peripheralshot, and protects the inside of the apparatus from contaminations bythe resist 41. This configuration achieves a transfer of a pattern to aperipheral shot, maximizing the wafer, and provides more validsemiconductor chips by 16 per wafer than the layout shown in FIG. 3 inwhich no peripheral shots are transferred so as to prevent the resistfrom flowing out of the wafer. Here, the layout of FIG. 3B is aconventional example of 13 shots, which has no peripheral shots.

FIG. 4 shows a sectional view of a resist recovery means (a wafer chuck22A) according to a second embodiment applicable to the nanoimprintapparatus similar to the first embodiment, and illustrates only thewafer chuck 22A's structure. Components in FIG. 4 other than therecovery port 33A are similar to those in the first embodiment in FIG.2, and thus a duplicate description thereof will be omitted. Therecovery port 33A is formed on the wafer chuck 22A. An annular groove asthe recovery port 33A extends along the wafer 21's outer circumferenceon its attracting surface. The groove's outer circumference is largerthan the wafer's, and the groove's inner circumference is smaller thanthe wafer 21's contour. As shown in FIG. 4, when the wafer chuck 22Aholds the wafer 22, the recovery port 33A abuts the back surface of thewafer 21's outer circumference (wafer attracted surface). The recoveryport 33A enables the recovery port 33A to directly and securely recoverthe resist 41 that flows down when the peripheral shot is transferred.The wafer chuck 22A has a reduced supporting area for the wafer'sbackside, but can securely recover the resist 41.

FIG. 5 shows a sectional view of a resist recovery means (wafer chuck22B) according to a third embodiment. Similar to the first and secondembodiments, it is applied to the nanoimprint apparatus, and FIG. 5shows only the structure of the wafer chuck 22B. Elements in FIG. 5other than the recovery port 33B are similar to those in the firstembodiment in FIG. 2, and thus a duplicate description thereof will beomitted.

The wafer chuck 22B has a concave shape with a center dent, and the dentis the surface of the wafer chuck. The size of difference in level is soset that when the wafer 21 is held, the surface of the wafer and theheight of the wafer chuck's periphery are about the same level ofsurface. This configuration equally presses the entire pattern surfaceof the mold that transfers the pattern to the peripheral shot andrealizes a highly accurate transfer. As shown in FIG. 5, the recoveryport 33B surrounds the circumference of the wafer 21 and extends to therise higher than the wafer 21. When viewed from the top, the surface ofthe wafer chuck 22B forms double rings. The inner recovery port recoversthe resist that flows outside the wafer, and the outer recovery portrecovers the resist that the inner recovery port could not recover. Thisconfiguration also recovers resist 41 that drops outside the wafer. Thedouble recovery ports on and outside the wafer can securely recover thesplitting resist.

FIG. 6 shows a schematic sectional view of a photo-curing nanoimprintapparatus 10C as an example of processing apparatus of a fourthembodiment, and FIG. 7 is an enlarged sectional view near the mold 11C.The apparatus 10C mainly includes elements supported by a mainframe 51Cand a stage support frame 52C. While the above embodiments locates thewafer stage 23 movable on an XY plane below the mold 11 and presses themold 11 against the wafer while facing its pattern surface down duringthe transfer, the apparatus 10C locates the wafer stage 23C above themold 11C and holds the mold 11C with its pattern surface facing up. Intransfer, the mold 11C is elevated from the bottom to the wafer 21C thatfaces down, and pressed against the wafer 21C.

A light source 15C, an illumination optical system 14C, an imprintmechanism 13, and a mold chuck 12C are held in the mainframe 51C. Thestage support frame 52C is connected to the mainframe 51C. The stagesupport frame 52C supports and hangs the wafer stage 23C. Except for thereverse positional relationship between the mold 11C and the wafer 21C,the fundamental roles of each element are the same as those in theforegoing embodiments. The apparatus 10C is different from the apparatus10 and others in that the apparatus 10C includes a nozzle driver 36C.While the above embodiments moves the wafer stage 23 moves to the fixednozzle position and drops the resist on a predetermined shot position,this embodiment always drops the resist 42 on the mold 11C.

A pattern transfer to the wafer 21C utilizes the step-and-repeat manneras in the foregoing embodiment. A description will now be given of anoperation to each shot. Since the resist 42 is dropped on the mold 11Crather than the wafer 21C, some operations are different from those inthe prior art. In dropping the resist, the nozzle 32C is moved above themold. After a transfer to the previous shot is finished and the mold 11Cmoves down, the nozzle driver 36C moves the nozzle 32C above the mold.Then, the nozzle 32C drops the resist 42. The nozzle may move and dropthe resist for uniform dropping of the resist on the pattern surface ofthe mold 11C. Upon completion of dropping the resist 42, the nozzledriver 36C retreats the nozzle 32C and prevents the interference betweenthe nozzle 32C and the mold 11C when the mold 11C is being elevated andpressed against the wafer 21C. The imprint mechanism 13C has a z strokeenough to introduce the nozzle 32C between the wafer 21C and the mold11C.

In operation, after the mold 11C moves down, the nozzle 32C moves abovethe mold 11C, and drops an adequate amount of resist 42. The nozzle 32Cretreats after dropping the resist. The mold 11C is moved up and pressedagainst the wafer 21C. During pressing, the illumination light isirradiated via the light source 15C and the illumination optical system14C, and cures the resist 42. Then, the mold 11C moves down. The resist42 that forms a pattern remains on the wafer surface. The wafer stage23C is moved to the next shot position.

With reference to FIG. 7, the nozzle 32C moves above the mold 11C anddrops the resist 42. The mold chuck 12C holds the mold 11C throughvacuum attractions. A vacuum attraction pipe 29 is installed in the mold11C, and connected to a vacuum pumping system (not shown). A recoveryport 33C having the same size and shape as those of the mold is providedaround the circumference of the mold 11C. The groove is cut along thecircumference of the mold 11C, and connected to the recovery unit 34,which can recover the resist that flows out of the mold 11C and into therecovery port 33C. The central part of the mold chuck 12C has an openingfor the illumination light for curing the resist to pass through. Theresist 41 from the nozzle 32C when spilling from the mold 11C is acontamination source in the apparatus 10C, and thus recovered from therecovery port 33C. The recovery port extends along the circumference ofthe mold 11C, and recovers the resist 41 without fail.

Thus, a pattern transfer with the mold pattern surface facing upward anda recovery of the resist through the mold chuck protect the wafer 21from contaminations by the resist. While this embodiment provides themold chuck 12C with the opening, the present invention is not limited tothis embodiment and may use a different recovery means such as a pailstructure around the circumference of the mold chuck 12C.

Referring now to FIGS. 8 and 9, a description will be given of anembodiment of a device manufacturing method using the above nanoimprintapparatus 10. FIG. 8 is a flowchart for explaining how to fabricatedevices (i.e., semiconductor chips such as IC and LSI, LCDs, CCDs,etc.). Here, a description will be given of the fabrication of asemiconductor chip as an example. Step 1 (circuit design) designs asemiconductor device circuit. Step 2 (mold fabrication) forms a moldthat forms a pattern corresponding to a designed circuit pattern. Step 3(wafer preparation) manufactures a wafer using materials such assilicon. Step 4 (wafer process), which is also referred to as apretreatment, forms actual circuitry on the wafer through thenanoimprint technique using the mold and wafer. Step 5 (assembly), whichis also referred to as a post-treatment, forms into a semiconductor chipthe wafer formed in Step 4 and includes an assembly step (dicing andbonding), a packaging step (chip sealing), and the like. Step 6(inspection) performs various tests for the semiconductor device made inStep 5, such as a validity test and a durability test. Through thesesteps, a semiconductor device is finished and shipped (Step 7).

FIG. 9 is a detailed flowchart of the wafer process in Step 4. Step 11(oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms aninsulating film on the wafer's surface. Step 13 (electrode formation)forms electrodes on the wafer by vapor disposition and the like. Step 14(ion implantation) implants ions into the wafer. Step 15 (transfer)presses the mold against the wafer while applying a photosensitivematerial to the wafer, and irradiates the UV light to transfer thecircuit pattern onto the wafer. Step 16 (etching) uses reactive ionetching (RIE) to complete the patterning operation. Step 17 (resiststripping) removes disused resist after etching. Thus, devices (i.e.,semiconductor chips, LCD devices, photographing devices (such as CCDs,etc.), thin-film magnetic heads, and the like) are fabricated. Thesesteps are repeated, and multi-layer circuit patterns are formed on thewafer. The device manufacturing method of this embodiment uses thephoto-curing method and maintains the high overlay accuracy. Inaddition, the use of the low-viscosity resist easily covers a fine moldpattern realizing the fine processing, and a transfer of the moldpattern to the peripheral shot improves the economical efficiency.Moreover, a recovery of the resist can prevent the contamination of theapparatus and wafer, providing high-quality devices. Thus, the devicemanufacturing method using the nanoimprint technology of thisembodiment, and devices as a resultant product constitute one aspect ofthis invention. The present invention intends to cover devices asintermediate and final products of this device manufacturing method.Such devices include semiconductor chips such as LSI, VLSI and the like,CCDs, LCDs, magnetic sensors, thin film magnetic heads, and the like.

Thus, these embodiments can provide a processing apparatus that has goodoverlay accuracy, fine processing and economical efficiency, and canprevent resist's contaminations.

Further, the present invention is not limited to these preferredembodiments, and various variations and modifications may be madewithout departing from the scope of the present invention.

This application claims a benefit of priority based on Japanese PatentApplication No. 2004-096991, filed on Mar. 29, 2004, which is herebyincorporated by reference herein in its entirety as if fully set forthherein.

1. A processing apparatus for transferring a relief pattern on a mold toa resist on a substrate through a compression of the mold against theresist, said processing apparatus comprising: a supplier for supplyingthe resist between the substrate and the mold; and a recovery unit forrecovering the resist.
 2. A processing apparatus according to claim 1,further comprising a holder for holding the substrate, wherein saidrecovery unit is provided in the holder.
 3. A processing apparatusaccording to claim 2, wherein said recovery unit is located at an outerperipheral part of a portion of said holder for holding the substrate.4. A processing apparatus according to claim 1, wherein said recoveryunit includes: a base provided with an attraction hole for attractingthe resist; and a vacuum pumping unit connected to the attraction hole.5. A processing apparatus according to claim 4, wherein the attractionhole attracts part of the substrate.
 6. A processing apparatus accordingto claim 4, wherein the base has a concave for housing the substrate,and a surface of the substrate fitted in the concave is level withsurfaces other than the concave of the base.
 7. A processing apparatusaccording to claim 1, further comprising a holder for holding thesubstrate, wherein the holder has a concave for housing the substrate,and a surface of the substrate fitted into the concave part is levelwith surfaces other than the concave.
 8. A processing apparatusaccording to claim 1, wherein part of the mold is located outside thesubstrate, and the mold is driven relative to the substrate with onlypart of the pattern being transferred to the resist.
 9. A processingapparatus according to claim 1, further comprising a member forirradiating light for curing the resist, and said processing apparatusserves as a nanoimprint apparatus.
 10. A processing apparatus fortransferring a relief pattern on a mold to a resist on a substratethrough a compression of the mold against the resist, said processingapparatus comprising a support for supporting the substrate arranged ona more upstream side than the mold in terms of a gravitationaldirection.
 11. A processing apparatus according to claim 10, furthercomprising a supplier for supplying the resist on a mold side betweenthe substrate and the mold.
 12. A processing apparatus according toclaim 10, further comprising a recovery unit for recovering the resist.13. A processing apparatus according to claim 12, further comprising aholder for holding the mold, wherein said recovery unit is provided tosaid holder.
 14. A processing apparatus according to claim 13, whereinsaid recovery unit is located at an outer peripheral part of a portionof said holder for holding the substrate.
 15. A processing apparatusaccording to claim 12, wherein said recovery unit includes: a baseprovided with an attraction hole for attracting the resist; and a vacuumpumping unit connected to the attraction hole.
 16. A processingapparatus according to claim 15, wherein the attraction hole attractspart of the mold.
 17. A processing apparatus according to claim 10,wherein part of the mold is located outside the substrate, and the moldis driven relative to the substrate with only part of the pattern beingtransferred to the resist.
 18. A processing apparatus according to claim10, further comprising a member for irradiating light for curing theresist, and said processing apparatus serves as a nanoimprint apparatus.19. A device manufacturing method comprising the steps of: transferringa pattern onto resist on a substrate by using a processing apparatusaccording to claim 1; and and etching the substrate.
 20. A devicemanufacturing method comprising the steps of: transferring a patternonto resist on a substrate by using a processing apparatus according toclaim 8; and and etching the substrate.